Hybrid Capabilities
Our advanced hybrid microelectronic manufacturing capabilities
- Interconnect Technology
- Die Attach – Conductive and Non-Conductive Epoxies, Eutectic
- Wire Bond (Manual and Auto Wire Bond) – Gold and Aluminum, Large Diameter Aluminum
- IC Packaging
- Underfill and Encapsulation
- Die Encapsulation (Glob-Top, Silicone)
- Marking
- Laser and Printed Labels
- Welding/Sealing
- TO Resistance Welding
- Seam Sealing
- Epoxy Seal
- Au Sn Solder Seal
- Test and Measurement
- Gross Leak Testing
- Fine Leak Testing
- Temperature Cycling
- Shear and pull test for wire and die bond adhesion
Would you like to discuss a program?
Our team is always at the ready to discuss the needs and parameters of your next program. See how our higher degree of manufacturing can ensure your product’s success.