We constantly invest in our manufacturing capabilities
Our manufacturing facilities are equipped to provide our customers with Class 3 MIL-STD Products, and High-Volume production levels while assuring optimal quality and on-time delivery. Over four decades, we have developed advanced manufacturing processes and quality controls for electronic and electromechanical products requiring the harshest operating environments. Our ability to effectively process unique soldering alloys that meet and exceed the highest quality/reliability requirement is a key differentiator.
Electronic and Electromechanical Assembly:
- SMT, Through-Hole, and Mixed Technology Assembly
- Double-Sided PCBs, Flex and Rigid-Flex Circuits
- 01005 Components
- Fine Pitch and High Count BGAs
- Package on Package (POP)
- Chip on Board
- Fiber Optics
- RF Microelectronics
- Connectors
- Automated Wave and Selective Soldering
- Wide Range of Automated and Manual Soldering Capabilities
- Automated Optical and X-Ray Inspection
- Component Tinning
- Conformal Coating Solutions
- Staking, Encapsulation and Potting
- XRF Testing
- Complete Lot Serialization and Traceability
Would you like to discuss a program?
Our team is always at the ready to discuss the needs and parameters of your next program. See how our higher degree of manufacturing can ensure your product’s success.